Industry's First AI Multiphysics Thermal Platform
Cadence Celsius Studio Platform
Leading electrothermal co-simulation innovation — converging electrothermal co-simulation, electronics cooling, and thermal stress into a single cohesive platform. Electrical and mechanical engineers concurrently design and analyse in one environment with AI-driven generative optimisation.
Overview
Unified AI Thermal Analysis — Electrical & Mechanical, One Platform
Celsius Studio is the industry's first complete AI-enabled thermal platform for electronic systems — addressing thermal analysis, thermal stress, and electronics cooling. While current offerings are mostly point tools, Celsius Studio introduces a unified platform where electrical and mechanical engineers concurrently design and analyse without geometry simplification, manipulation, or translation.
As in-design multiphysics analysis, it empowers designers to discover thermal-integrity issues early and leverage generative AI optimisation for ideal thermal designs — streamlining collaboration, reducing design iterations, and accelerating time to market.
2
Solvers in our offering
10X
Faster than legacy thermal
FEA+CFD
Solids + fluids multiphysics
Chip→Sys
IC to package to enclosure
Key Benefits
Efficiency, Precision, and Innovative Insights
Save design time and optimise resources while gaining true cross-discipline visibility into thermal behaviour.
In-Design Analysis
Harness the synergy of Cadence's robust portfolio of technologies — elevating electronic design to unprecedented heights by integrating thermal analysis throughout the design phases.
Design Insight
Fast and efficient exploration of the full design space — converge on the optimal design through integrated AI-driven generative technology and novel modelling algorithms.
Complete System Thermal Analysis
Combines finite element method (FEM) with computational fluid dynamics (CFD) for total system analysis — from chip to enclosure, with no domain handoffs.
Applications
Solving Your Most Complex Thermal Challenges
In-design analysis tailored to the design domain you work in.
SoC Design
Optimise floorplans, analyse performance across voltage / frequency corners under thermal constraints, and pinpoint temperature-sensor locations with precision.
MMIC Design
RF PA / monolithic microwave IC designs, RF PCBs, and modules — seamless electrothermal analysis using model data sourced from RF circuit simulation.
IC Packaging Design
Transient electrothermal co-simulation to pinpoint temperature and current-density issues in packages with precision and accuracy.
PCB Design
Full-scale PCB design using in-design electrothermal analysis — abandon over-design tactics; achieve precise IR drop and thermal-efficiency calculations.
Capabilities
Shift-Left, In-Design Thermal Analysis
Complete shift-left in-design thermal analysis — detect and prevent defects early, from chip to PCB to system level, with AI and machine-learning technologies optimising component integration.
Electrothermal Innovation
Supports all ECAD and MCAD file formats with robust material and component managers. Static and transient electrothermal co-simulation integrated with Clarity 3D Solver, Sigrity X, and Spectre Simulation.
Mechanical Stress Analysis
Linear and nonlinear material structural models, static and quasi-static solvers for warpage / stress. Moisture and HTHH analysis, multi-stage assembly simulation, 3D-IC global/local warpage and stress.
AI-Enabled Optimisation
Pioneering AI-enabled optimisation with Monte Carlo and sensitivity studies for rigorous DFM validation. Thermal RC / compact model generation, metamodel chip / package / server characterisation.
In-Design Analysis
Integrates with Cadence platforms for early thermal detection: Innovus (digital IC), Virtuoso Studio (custom IC), AWR (MMIC), Allegro X (package & PCB), Integrity 3D-IC Platform.
Electronics Cooling
Dynamic electronics cooling simulation to optimise the thermal efficiency of entire electronic ecosystems — boards, modules, assemblies, enclosures.
Massively Parallel Solvers
Up to 10X faster performance than existing solutions without compromising accuracy — designed for 3D-ICs and complex 3D structures.
Inside Celsius Studio
Two Production Solvers, One Platform
Each solver targets a different scale of the problem — together they cover chip-to-enclosure thermal design.
Celsius Thermal Solver
Industry's first complete electrothermal co-simulation — FEA + CFD across chip, IC package, PCB, and full physical enclosure. Identify hot spots, thermal stress, and reliability risks early.
Learn More
Celsius EC Solver
Electronics cooling CFD — analyse airflow, temperature, and heat transfer in assemblies and enclosures. Scalable to hundreds of cores for high-complexity systems.
Learn MorePlatform Highlights
Celsius Studio Features
| Feature | Description |
|---|---|
| Multiphysics Technology & Field Solvers | Combines robust FEA solvers with advanced FEM meshing technology to streamline and expedite meshing for complex systems. |
| Transient & Steady-State Analysis | Accurate electrothermal co-simulation through both transient and steady-state analysis of heat conduction in intricate solid structures. |
| Massively Parallelized Execution | Up to 10X faster performance than existing solutions without compromising accuracy when analysing 3D-ICs and complex 3D structures. |
| Electrothermal Reliability | Seamless integration with Cadence IC, package, microwave/RF, and PCB implementation platforms accelerates and simplifies design iterations. |
| Temperature Data | Ready access to operating temperature data for reliability and performance studies. |
| Thermal Stress & Strain | Accurate simulation of thermal-induced stress and strain in solids to pinpoint problem areas. |
| MCAD Integration | Import complex MCAD models from PTC Creo, SOLIDWORKS, CATIA, and others without simplification. Automatic positioning of modelling objects, object-based meshing, collision / error checks before solving. |
Native Integrations
Plugged Into the Full Cadence Stack
Celsius Studio doesn't ask designers to leave the design environment. It integrates natively with Cadence's IC, package, RF, and PCB platforms — analyse, iterate, and sign off without database hops.
Connected platforms
- Innovus Implementation System (digital IC)
- Virtuoso Studio (custom IC)
- AWR Design Environment (MMIC)
- Allegro X Design Platform (package & PCB)
- Integrity 3D-IC Platform
- Clarity 3D Solver
- Sigrity X Platform
- Spectre Simulation
Get Started
Ship Cooler, Quieter, More Reliable Products
Talk to Craftronics about Celsius Studio — licensing, training, and India-specific deployment of the full thermal multiphysics platform.