Industry's First Electrothermal Co-Simulation — Chip to Enclosure
Cadence Celsius Thermal Solver
Electrothermal co-simulation that maximises the efficiency, tolerance, and power of the products you're putting all your effort into. Complete electrical-thermal analysis from chips and packages to PCBs and full physical enclosures — up to 10X faster than legacy thermal tools.
Overview
Complete Electrothermal Tech, Full Stack
Celsius Thermal Solver is the industry's first complete electrothermal co-simulation for the full hierarchy of electronic systems — chips, packages, boards, and full physical enclosures. It empowers electrical design teams to detect and mitigate thermal issues early, reducing system development iterations.
Targeting pre-layout design and post-layout verification, the solver helps users quickly develop a product's thermal management system and identify hot spots and thermal stress-related issues — among the leading field-failure risks in electronic systems.
Key Benefits
Speed, Accuracy, Capacity, Streamlined Workflow
Design Insight
Minimise late-stage iterations, costly implementations, engineering delays, and field failures — run thermal simulations early in the design phase.
Greater Productivity
Massively parallel execution delivers up to 10X faster performance than existing solutions without compromising accuracy.
Electrothermal Reliability
Seamless integration with Cadence IC, package, RF, and PCB platforms accelerates and simplifies design iterations.
Complete System Analysis
Multiphysics combines FEA for solid structures with CFD for fluids — detailed analysis of the entire system.
Features
What the Solver Can Do
Transient & Steady-State
Accurate electrical-thermal co-simulation for transient, steady-state, and heat conduction in complex solid structures.
Operating Temperature Data
Ready access to operating temperature data for downstream reliability and performance studies.
Large Designs, Full Detail
Import and analyse large package and PCB designs in full detail — no input simplification, joule heating, stress, and warpage included.
Thermal Stress & Strain
Accurately simulate thermal-induced stress and strain in solids — pinpoint problem areas, avoid costly reliability issues.
Advanced FEM Meshing
Finite-element method meshing technology makes meshing any complex system fast and easy.
Joule-Heating Coupled
Joule heating computed alongside thermal — capture self-heating effects on conductors and planes accurately.
Applications
Your Most Complex Thermal Challenges, Solved
SoCs
Floorplan optimisation, performance under thermal constraints (V/F corners), accurate temperature-sensor placement.
MMICs
RF PA / monolithic microwave IC designs — electrothermal analysis driven by circuit-design data (layout, material, RF power).
IC Packages
Transient electrothermal co-simulation to accurately identify temperature and current-density issues in packages.
PCB Modules
Electrothermal co-simulation for full PCBs without simplification; IR drop computed from joule heating.
Systems
Develop full thermal management; identify hot spots and thermal stress — leading field-failure risks in electronics.
Integration
Native to the Cadence Design Flow
Celsius Thermal Solver is integrated with Cadence's chip, package, and PCB platforms — designers can work in a single environment, share data, and automate workflows across user interfaces.
Connected platforms
- Allegro PCB Designer
- AWR Design Environment
- Innovus Implementation System
- Virtuoso Design Platform
- Voltus IC Power Integrity Solution
Related
Works Well With
Celsius EC Solver
Electronics cooling CFD — natural companion for enclosure-level airflow and thermal analysis.
Learn More
Sigrity X
PI / SI signoff family — combine with Celsius for thermal-aware PI and IR-drop signoff.
Learn More
Clarity 3D Solver
3D EM solver — pair with Celsius for fully coupled EM-thermal multiphysics studies.
Learn MoreGet Started
Catch Thermal Risk Before Silicon Sees Lab
Talk to Craftronics about Celsius Thermal Solver for IC, package, and PCB electrothermal co-simulation.