Gold-Standard FEM EM Solver — Signoff at 112 Gbps+
Cadence Clarity 3D Solver
3D EM simulation for designing critical interconnects in PCBs, IC packages, and systems-on-IC (SoIC). FEM-based gold-standard accuracy at 112 Gbps+, 10X capacity, and near-linear scalability for 5G, automotive, HPC, and ML applications.
Overview
No More Fracturing. No More Stitching.
Clarity 3D Solver is built on highly accurate finite element methods (FEM) from the ground up — designed to take advantage of multicore compute resources by parallelizing the mathematical work required to solve complete 3D structures. No fracturing the design into pieces. No stitching results back together.
Cadence's distributed multiprocessing technology delivers virtually unlimited capacity and the 10X speed needed to address larger, more complex structures with gold-standard accuracy.
Key Capabilities
FEM Engineered for Signoff
S-Parameter Extraction
Highly accurate S-parameter models for SI, PI, RF / microwave, and EMC analysis — results match lab measurement at 112 Gbps+ data rates.
10X Capacity & Performance
Near-linear scalability and accuracy approaching physical measurement — pair with the right compute and the solver scales with it.
On-Demand Cloud
Cloud integration brings compute resources online with the push of a button — handle the biggest runs without owning the hardware.
AWR Design Environment
Integrated within the AWR Design Environment — high-capacity EM analysis for RFIC / MMIC, module, and RF PCB design verification and signoff.
User-Selected Extraction
EM simulation through user-selected components and subcircuits in Microwave Office — automated simulation-ready EM documents with ports, stackup, and boundaries.
Heterogeneous Hierarchy
EM document hierarchy across heterogeneous technologies — analyse a single integrated design that spans multiple process / fab boundaries.
Massively-Parallel Engine
Match Your Compute to Your Design
Take advantage of multi-core compute by parallelizing the mathematical tasks required to solve 3D structures. The Clarity elastic compute architecture is automatically partitioned, so simulations run on machines of any capacity with unbounded scalability.
- Massively-parallel matrix solver with breakthrough adaptive mesh refinement
- Parallelized frequency-sweep processing for near-linear scalability
- Merge mechanical structures (cables, connectors) with system design as a single EM model
- Automatic partitioning — run on any compute footprint, scale up without re-setup
3D geometry models
Modelithics 3D Library
Measurement-Validated Component Models
Nearly 400 3D geometry models for accurate, measurement-validated simulation. Encrypted full-wave EM analysis models for inductors, resistors, filters, connectors, and packages — each based on physical dimensions and material properties, with its own fully documented datasheet.
Benefits
What This Buys Your Team
Avoid Costly Iterations
Simulate potential design flaws before they become costly implementations, engineering delays, product re-spins, and field failures.
Predict Lab Behaviour
Eliminate late-stage design iterations by accurately predicting how the product will perform in the lab.
Cross-Team Efficiency
Improve communication between RF / microwave IC, packaging, and PCB design / analysis teams through shared models and simulation data.
Related
Works Well With
Clarity 3D Transient Solver
FDTD time-domain solver — natural companion to Clarity 3D Solver for EMI / EMC compliance and antenna placement.
Learn More
Sigrity X
PI / SI signoff family — Clarity feeds Sigrity Advanced SI with hyper-accurate S-parameter models.
Learn More
Allegro X APD
IC package design platform — Clarity integrates directly with Allegro Package Designer and SiP Layout Option.
Learn More
Get Started
Sign Off Your Most Complex EM Designs With Confidence
Talk to Craftronics about Clarity 3D Solver for your 5G, automotive, HPC, or ML high-frequency design flow.