EM Model Extraction for Packages & ICs
Sigrity XtractIM
EM model extraction built for high-performance package and IC design. Generate hyper-accurate electromagnetic models that feed downstream Sigrity SI, PI, and thermal analysis — characterising interconnect behaviour before silicon arrives.
What XtractIM Does
Hyper-Accurate Package EM Models, Fast
Sigrity XtractIM extracts broadband, SPICE-ready electromagnetic models directly from your IC package designs. It captures the full electrical behaviour of interconnects — losses, coupling, parasitics, return paths — so downstream signal and power integrity analysis is grounded in physics, not approximation.
Pair XtractIM with Allegro X APD for a complete IC-package design + characterisation flow.
Hyper-Accurate Models
Broadband EM models that capture real-world interconnect behaviour, not idealised approximations.
Built for Speed
Optimised for fast extraction even on large, complex package designs.
Package-Aware
Purpose-built for IC package EM extraction — handles wirebond, flip-chip, WLP, and 3D-IC structures.
Feeds Sigrity Flow
Outputs SPICE-ready macromodels that drop into Sigrity SI/PI/thermal analysis flows seamlessly.
Use Cases
Where XtractIM Fits in the Flow
Signal Integrity Pre-Tape-Out
Characterise package interconnect behaviour before silicon arrives — channel loss, crosstalk, return path, mode conversion.
Power Integrity Analysis
Extract accurate models for power delivery network (PDN) analysis at the package level — impedance, voltage droop, decap effectiveness.
Electrothermal Co-Simulation
Feed thermally-aware models into Celsius for electrothermal analysis — see how package routing impacts temperature, and vice versa.
3D-IC & Chiplet Characterisation
Extract models for through-silicon vias (TSVs), interposer routing, and die-to-die interfaces — critical for chiplet-based designs.
System-Level Signoff
Combine package models with PCB models to validate full system performance — chip / package / board together.
RF Module Design
Extract accurate broadband models for RF and mm-wave package designs — feed into AWR and Sigrity for system-level analysis.
Workflow
How It Fits Your Design Flow
Three clear stages — design, extract, analyse — all inside the Cadence platform.
Design in APD
Build your package design in Allegro X APD — wirebond, flip-chip, WLP, 3D-IC. Layout is the single source of truth.
Extract with XtractIM
Run XtractIM on the APD design. Hyper-accurate broadband EM models are extracted automatically — including parasitics, coupling, and losses.
Analyse in Sigrity
Drop the extracted SPICE models into Sigrity SI/PI/thermal flows. Validate channel performance, PDN behaviour, and thermal margin pre-tape-out.
Works Well With
Complete Your IC Package Flow
Allegro X APD
The IC package design platform — the natural partner to XtractIM extraction.
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Sigrity X Platform
Signal & power integrity analysis platform — consumes XtractIM models for SI/PI signoff.
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Clarity 3D EM Solver
Full-wave 3D EM solver for the most demanding interconnect modelling.
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Celsius Thermal Solver
Electrothermal analysis using XtractIM-extracted models for system-level temperature impact.
Learn MoreFAQs
XtractIM — Common Questions
Broadband, SPICE-ready electromagnetic macromodels of package interconnect — capturing R, L, C, mutual coupling, losses, and return-path behaviour. Models are ready to drop into Sigrity SI, PI, and thermal simulation flows.
XtractIM is purpose-built for IC package designs and works most directly with APD. It can also work with other Sigrity-supported package formats.
XtractIM is optimised for IC package EM extraction. For board-level EM extraction the Cadence platform offers other Sigrity tools and Clarity 3D EM Solver — your Craftronics rep can guide you to the right tool for your task.
XtractIM is built for broadband extraction — covering DC up through the high-frequency ranges needed for modern interconnect characterisation including high-speed digital and mm-wave RF.
XtractIM is purpose-built for IC package extraction with optimisations for typical package geometries (TSVs, bumps, traces, planes), giving you much faster extraction times than running a general-purpose 3D solver on the same design.
Yes — contact Craftronics for evaluation setup and India-specific licensing options.
Get Started
Get Hyper-Accurate Package Models Into Your Flow
Talk to Craftronics about Sigrity XtractIM licensing, training, and integration with your existing Sigrity flow.